hi-sincerity microelectronics corp. spec. no. : he9031 issued date : 1998.07.01 revised date : 2001.09.14 page no. : 1/4 HI117 hsmc product specification HI117 pnp epitaxial planar transistor description the HI117 is designed for use in general purpose amplifier and low-speed switching applications. absolute maximum ratings (ta=25 c) ? maximum temperatures storage temperature .......................................................................................................... - 55 ~ +150 c junction temperature .................................................................................................. +150 c maximum ? maximum power dissipation total power dissipation (tc=25 c) ................................................................................................... 25 w ? maximum voltages and currents bvcbo collector to base voltage ................................................................................................ .. -100 v bvceo collector to emitter voltage............................................................................................. .. -100 v bvebo emitter to base voltage .................................................................................................. ....... -5 v ic collector current (continue) ................................................................................................ .......... -4 a ic collector current (peak) .................................................................................................... ............ -6 a characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo -100 - - v ic=-1ma bvceo -100 - - v ic=-30ma icbo - - -1 ma vcb=-100v iceo - - -2 ma vce=-50v iebo - - -2 ma veb=-5v *vce(sat) - - -2.5 v ic=-2a, ib=-8ma *vbe(on) - - -2.8 v ic=-2a, vce=-4v *hfe1 1 - - k ic=-1a, vce=-4v *hfe2 500 - - ic=-2a, vce=-4v cob - - 200 pf vcb=-10v, f=0.1mhz *pulse test : pulse width 380us, duty cycle 2% darlington schematic r2 r1 c e b
hi-sincerity microelectronics corp. spec. no. : he9031 issued date : 1998.07.01 revised date : 2001.09.14 page no. : 2/4 HI117 hsmc product specification characteristics curve capacitance & reverse-biased voltage 10 100 1000 0.1 1 10 100 reverse-biased voltage (v) capacitance (pf) cob switching time & collector current 0.1 1 10 110 collector current (a) switching time (us) v cc =30v, i c =250i b1 =-250i b2 tstg tf ton current gain & collector current 1 10 100 1000 10000 1 10 100 1000 10000 collector current-i c (ma) hfe hfe @ v ce =3 v hfe @ v ce =4v saturation voltage & collector current 100 1000 10000 100000 100 1000 10000 collector current-i c (ma) saturation voltage (mv) v ce(sat) @ i c =250i b v ce(sat) @ i c =100i b saturation voltage & collector current 100 1000 10000 100 1000 10000 collector current-i c (ma) saturation voltage (mv) v be(sat) @ i c =100i b v be(sat) @ i c =250i b on voltage & collector current 100 1000 10000 1 10 100 1000 10000 collector current-i c (ma) on voltage (mv) v be(on) @ v ce =3v v be(on) @ v ce =4v
hi-sincerity microelectronics corp. spec. no. : he9031 issued date : 1998.07.01 revised date : 2001.09.14 page no. : 3/4 HI117 hsmc product specification safe operating area 1 10 100 1000 10000 1 10 100 forward voltage-v ce (v) collector current-i c (ma) p t =1ms p t =100ms p t =1s
hi-sincerity microelectronics corp. spec. no. : he9031 issued date : 1998.07.01 revised date : 2001.09.14 page no. : 4/4 HI117 hsmc product specification to-251 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0177 0.0217 0.45 0.55 g 0.2559 - 6.50 - b 0.0354 0.0591 0.90 1.50 h - *0.1811 - *4.60 c 0.0177 0.0236 0.45 0.60 i - 0.0354 - 0.90 d 0.0866 0.0945 2.20 2.40 j - 0.0315 - 0.80 e 0.2520 0.2677 6.40 6.80 k 0.2047 0.2165 5.20 5.50 f 0.2677 0.2835 6.80 7.20 notes : 1.dimension and tolerance based on our spec. dated may. 24,1995. 2.controlling dimension : millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing s pecification or packing method, please c ontact your local hsmc sales office. material : ? lead : 42 alloy ; solder plating ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance. head office and factory : ? head office (hi-sincerity microelectronics corp.) : 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel : 886-2-25212056 fax : 886-2-25632712, 25368454 ? factory 1 : no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel : 886-3-5983621~5 fax : 886-3-5982931 a e f g h j i 3 2 1 k c d b style : pin 1.base 2.collector 3.emitter 3-lead to-251 plastic package hsmc packa g e code : i marking: date code ink mark 2 17 hi control code
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